Epicyn hydrogel is the only available anti-microbial scar and wound treatment that effectively heals, prevents and removes scars. Epicyn works miracles on post-procedure, new and old hypertrophic and keloid scars. Deep wounds often result in scars that are hard to disappear over time. Scars are areas of tissue that replace normal skin after injury or surgery. During the healing process a thick layered scar might appear and leading to redness, itching, pain, and tight skin sensation.
The most common and most difficult to get rid of are the Hypertrophic and the Keloid scars. The Hypertrophic scars are red, thick and swollen, painful or itchy, and they are equal in size according to the affected area. However, the Keloid scars are thick, irregular and extend outside the wound area. They are often red and darker than the person’s skin color.
The safest and most effective way to treat and remove these scars is by using the silicone-based anti-microbial and moisturizer, Epicyn. Epicyn restores the skin culture, contributes to collagen improvement and moisturizes the skin. It also has a significant advantage in the management of old and new scars resulting from burns, general surgical procedures and trauma wounds.
What makes Epicyn different from all other scar treatments? Epicyn is the only scar reducing treatment that may be used immediately after wound appearance or wound suturing and there is no need to wait for 2 to 3 weeks until wound closure. Epicyn is clinically proven to help reduce redness, hardness and elevation. It relieves scar-associated itch and pain sensations, reduces the discoloration resulting from scars of various sizes, shapes and location. Epicyn is safe to use directly on stitches thus enhancing the wound healing process with its microbial composition.
Epicyn may be used up to 3 or 4 times daily, or as desired. To obtain effective results, the patient must first clean the affected area and dry it smoothly, then cover the affected skin with a thin layer of Epicyn and massage it onto the area gently.
